New Re-Work Techniques
Common PCB Fabrication Terms
- HASL – HASL Hot Air Solder Leveling
- ENIG – Electro Nickel Immersion Gold IPC-4552
- RO Cleaning – Reverse Osmosis Water Cleaning
- DI Cleaning – Deionized Water Cleaning
- Fiducials – Alignment aid used by automated assembly machines which are included on the Tabs or Rails of panel or on the PCB if no rails or tabs are used. These alignment aids are typicality 0.04″ in diameter and are not covered by solder mask or silk screen, however are typically plated in the same manner as the rest of the bare copper on the PCB.
- Panel Tabs – They provide stability and make it easier to handle the arrays throughout the assembly process. Tooling holes and fiducial markings are typically added to the tooling rails which are removed after PCB assembly is completed.
- Panel Rails – See Panel Tabs
- Tooling Holes – Automation Aid for conveyors or PCB Panel holding which can make use of these holes.
- MCPCB – Metal Core Printed Circuit Board; Typically AL Core Material, used for high power LED lighting applications.
Altium Designer Resources
- Altium 3D Layout Mode Short Cuts
- Altium Naming Convention
- Altium Net Ties
White Papers and Resources
- RO and DI Water White Paper
- Rohm micro IC packages Diodes
- Printed Circuit Board Defects Database NPL
- Saturn PCB Design Toolkit PCB Toolkit
- New PCB Re-Work Technique Left-In-Place Stencil
- IPC Foot Print Naming Convention IPC-7351
- Demystifying New Logic Packages & Footprints by NXP AN10161.pdf
- Linear Technologies Footprints and Packages Package Document List
- Linear Technologies Package Cross Reference Package Document List
- Diodes Incorporated Footprints and Packages AP02001
- Charge Pump application in LVDO SMPS SLVA444
- IPC Pin 1 Location Reference with Images Layout Pin 1
- More Pin 1 Location Ideas : IPC Presentation
- Mentor Graphics Blog Pin 1 Location Contradictions Competing Standards and the elusive Pin 1
- Part Designators https://en.wikipedia.org/wiki/Reference_designator
- Schematic Symbols https://en.wikipedia.org/wiki/Electronic_symbol
Resources for 3D Models
- https://www.stlfinder.com/
- https://www.3dcontentcentral.com/
- https://www.grabcad.com/
- https://www.turbosquid.com/
- https://free3d.com/
- https://www.cgtrader.com/
- https://clara.io/
- https://www.thingiverse.com/
High Current (> 100 Amps) PCB Design Resources
- PCB and High Current SMT considerations SMT Mechanical
- PCB and High Current Pressfit and SMT Lugs ERNI BLUEconnect
- PCB Plating Study Various Surface Finishes
PCB Vendors
PCB Materials
SVN – Subversion – TortoiseSVN Resources
- SVN Config for Altium Files & Ignore Settings
- Tortoise Config Files & Ignore Settings
- Tortoise Ignore Setting Examples
Common PCB Stack-Ups and Requirements
OSH Park Batch PCB Stack-Up Offering
Current 4 Layer Stackup as of May 1st, 2013 which requires 5 mil line width, 5 mil spacing, 10 mil via drill size and 4 mil via annular. 1 oz copper (1.4 mil) 6.7 mil prepreg 0.5 oz copper (0.7 mil) 47 mil core 0.5 oz copper (0.7 mil) 6.7 mil prepreg 1 oz copper (1.4 mil) Using high quality FR408 substrate having a dielectric constant of 3.66 at 1GHz. Old PCB Stack-Up used prior to April 15th, 2013. 1 oz copper (1.4 mil) 7.8 mil prepreg 0.5 oz copper (0.7mil) 39 mil core 0.5 oz copper (0.7 mil) 7.8 mil prepreg 1 oz copper (1.4 mil) Dielectric constant is 4.2 +/- 0.3