Design, Manufacturing, Modifications

Switch Mode Power Supply Design

  • Buck/Boost/Isolated-Flyback/SEPIC/CUK/Resonate-Topologies
  • Custom Wound Transformer Design for Hi/Low Voltage Applications
  • High/Low Temperature Designs & Wide Input Voltage Ratios 4:1 or greater
  • Multi Quadrant Power Supply Design
  • Medical Grade Isolation meeting IEC-60601 MOPP/MOOP

Motor Control & Power Inverter Design

  • Brushed-DC/BLDC/Stepper-Motor w/Encoder Feedback Closed-Loop
  • Cycle by Cycle Current & Total Power Limiting
  • Hardware and Firmware based Fault Detection (Over-Current, Over-Voltage)
  • High Voltage Motor/Xfrmr Windings for Sub-Sea & Down-Hole Applications
  • Large Ratio Transformer Windings for HV Flyback Design & Power Conversion
  • Past projects include motion control for medical devices

Microcontroller Hardware Design

  • ARM 32-Bit (Including STM32 and all Cortex-M Microcontrollers)
  • NXP i.MX6/7/8/9 Arm Based Processors
  • Nordic Semi nRF52805, nRF52840 & family of Bluetooth devices
  • Xilinx Zinq 7000 Ultrascale+ & Zinq RFSoC

RF, IoT & IIoT Hardware Design & Integration

  • General RF Design of:
    • RF Matching Networks for 50/75 Ohms
    • High-Speed & Wide-Band Frequency 10 MHz ~ 26 GHz
    • PCB Mounted Antennas: 2.4 GHz, 5 GHz & Chip Antennas
  • WiFi (implementing Client & Host for versatile applications)
  • Integration w/AWS IoT Core & FreeRTOS
  • Bluetooh 5.4 (low-power w/Nordic, TI, Cypress PSoC & others)
  • Mesh (low-power and/or long-range) using:
    • Xbee (Digi), SmartMesh IP (Dust Networks) and others
  • LoRa & Mesh Networks & LoRa Gateways

Harsh Environment & Extreme Miniaturization

  • Conversion of circuits to Ceramic Substrates & Exotic Stack-Ups:
    • To match CTE of Silicon or other critical material(s)
    • Die-Attach & Wire-Bonding with/without Dam & Fill
    • Hermetically Sealed Enclosures & Pass-Through Connections
    • Enclosures using Kovar, Al, Cu, MoCu, or CuW in “Bathtub” config
    • High Temperature DFM Assembly & BGA Under-Fill
  • Targeting:
    • High Reliability Assemblies
    • Extreme Temperature, Vibration & Shock Assemblies
    • Extreme Miniaturization of electronic assemblies
    • LiDAR and ultra-light weight for miniature drones
    • Downhole Tool, Implantable Medical Devices, Space Applications

Digital Interface Electronic Design

  • CAN-Bus (with isolation and lighting protection)
  • RS-232 / RS-485 / RS-422 (with isolation and RTCA/DO-160G )
  • Ethernet, TCP/IP, UDP/IP, etc…
  • SPI, I2C, SDIO, QuadSPI and parallel digital interfaces (Intel and Motorola Standards, etc.)

Analog Interface Electronic Design

  • Ultra-Low-Noise Power & uV or pA Analog Signal Detection
  • Analog Signal Conditioning, (Low-Pass, High-Pass Filters, etc.)
  • Ultra-Low-Noise Analog Front End including Trans-impedance Amplifier TIA
  • High-Speed/High-Resolution Bi-Polar, Differential ADC w/FPGA Integration
  • Closed-Loop control, PID, etc…

PCB Layout

  • Mixed Signal Analog/Digital/RF/Power-Conversion
  • RS-232 / RS-485 / RS-422 (w/isolation and RTCA/DO-160G )
  • UL & TUV Certification
  • IPC Standards including IPC-2221
  • High Voltage (multiple kV) & High Current (hundreds of Amps)