Switch Mode Power Supply Design

  • Buck/Boost/Isolated-Flyback/SEPIC/CUK/Resonate-Topologies
  • Custom Wound Transformer Design for Hi/Low Voltage Applications
  • High/Low Temperature Designs & Wide Input Voltage Ratios 4:1 or greater
  • Multi Quadrant Power Supply Design
  • Medical Grade Isolation meeting IEC-60601 MOPP/MOOP

Motor Control & Power Inverter Design

  • Brused-DC/BLDC/Stepper-Motor w/Encoder Feedback Closed-Loop
  • Cycle by Cycle Current & Total Power Limiting
  • Firmware-Based Thermal Control & Fault Detection
  • High Voltage Motor Windings for Sub-Sea & Down-Hole Applications
  • Large Ratio Transformer Windings for HV Flyback Design
  • Past projects include motion control for medical devices

Microcontroller Hardware Design

  • ARM 32-Bit (Including STM32F4 and all Cortex Processors)
  • NXP i.MX6/7/8 Arm Based Processors
  • Texas Instruments MSP430 Low-Power Devices
  • ATMEL 8, 16 & 32 Bit processors
  • Renesas Micro-Controllers, various families
  • Nordic Semi nRF52805, nRF52840, etc. Family of Bluetooth devices
  • Xilinx Zinq 7000 Ultrascale+ w/ARM Core & Linux OS
  • Altera Cyclone 10 w/DDR
  • CPLDs including Altera Max10 & Silego GreenPak
  • dsPIC Microchip & most families including PIC32 & 8 ~ 16-Bit Devices
  • Legacy 8051 Micro-Controllers using Assembly & C

Internet of Things (IOT)

  • General RF Design of:
    • RF Matching Networks for 50/75 Ohms & High-Speed & Frequency
    • PCB Mounted Antennas for 2.4 GHz, 5 GHz & Chip Antennas
  • WiFi (implementing Client & Host for versatile applications)
  • Integration w/Web & HTTPS/SSL Security Certificates
  • Integration w/AWS IoT Core & FreeRTOS
  • Bluetooh 5.0 (low-power designs using Nordic, TI, Cypress PSoC and others)
  • Mesh (low-power and/or long-range) using:
    • Xbee (Digi), SmartMesh IP (Dust Networks) and others
  • LoRa & Mesh Networks & LoRa Gateways using:
    • Semtech IC’s & Laird Modules
    • Gateways from RAK & Multitech

Harsh Environment & Extreme Miniaturization

  • Conversion of circuits to Ceramic Substrates & Exotic Stack-Ups:
    • To match CTE of Silicon or other critical material(s)
    • Die-Attach & Wire-Bonding with/without Dam & Fill
    • Hermetically Sealed Enclosures & Pass-Through Connections
    • Enclosures using Kovar, Al, Cu, MoCu, or CuW in “Bathtub” config
    • High Temperature DFM Assembly & BGA Under-Fill
  • Targeting:
    • High Reliability Assemblies
    • Extreme Temperature, Vibration & Shock Assemblies
    • Extreme Miniaturization of electronic assemblies
      • Electro-Mechanical moving or spinning assemblies targeting:
        • LiDAR and ultra-light weight for miniature drones
    • Downhole Tool, Implantable Medical Devices, Space Applications

Digital Interface Electronic Design

  • CAN-Bus (with isolation and lighting protection)
  • RS-232 / RS-485 / RS-422 (with isolation and RTCA/DO-160G )
  • Ethernet, TCP/IP, UDP/IP, etc…
  • PWM (Pulse-Width Modulated) for motor control, cycle-by-cycle current limiting
  • SPI, I2C, SDIO, QuadSPI and parallel digital interfaces (Intel and Motorola Standards, etc.)

Analog Interface Electronic Design

  • Standard Industrial Interfaces
    • 0 ~ 10 Volt Inputs (isolated and non-isolated)
    • -10 ~ +10 Volt Outputs
    • 4 ~ 20 mA, and other non-standard analog current loops
    • Ultra-Low-Noise Power & uV or pA Analog Signal Detection
  • HART communication protocol, PROFIBUS-DP, Modbus
  • EtherCAT and other industry standard protocols
  • Analog Signal Conditioning, (Low-Pass, High-Pass Filters, etc.)
  • Ultra-Low-Noise Analog Front End including Trans-impedance Amplifier TIA
  • High-Speed/High-Resolution Bi-Polar, Differential ADC w/FPGA Integration
  • Closed-Loop control, PID, etc…

PCB Layout

  • Mixed Signal Analog/Digital/RF
  • RS-232 / RS-485 / RS-422 (w/isolation and RTCA/DO-160G )
  • UL & TUV Certification
  • IPC Standards including IPC-2221
  • High Voltage (multiple kV) & High Current (hundreds of Amps)