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Switch Mode Power Supply Design
- Buck/Boost/Isolated-Flyback/SEPIC/CUK/Resonate-Topologies
- Custom Wound Transformer Design for Hi/Low Voltage Applications
- High/Low Temperature Designs & Wide Input Voltage Ratios 4:1 or greater
- Multi Quadrant Power Supply Design
- Medical Grade Isolation meeting IEC-60601 MOPP/MOOP
Motor Control & Power Inverter Design
- Brused-DC/BLDC/Stepper-Motor w/Encoder Feedback Closed-Loop
- Cycle by Cycle Current & Total Power Limiting
- Firmware-Based Thermal Control & Fault Detection
- High Voltage Motor Windings for Sub-Sea & Down-Hole Applications
- Large Ratio Transformer Windings for HV Flyback Design
- Past projects include motion control for medical devices
Microcontroller Hardware Design
- ARM 32-Bit (Including STM32F4 and all Cortex Processors)
- NXP i.MX6/7/8 Arm Based Processors
- Texas Instruments MSP430 Low-Power Devices
- ATMEL 8, 16 & 32 Bit processors
- Renesas Micro-Controllers, various families
- Nordic Semi nRF52805, nRF52840, etc. Family of Bluetooth devices
- Xilinx Zinq 7000 Ultrascale+ w/ARM Core & Linux OS
- Altera Cyclone 10 w/DDR
- CPLDs including Altera Max10 & Silego GreenPak
- dsPIC Microchip & most families including PIC32 & 8 ~ 16-Bit Devices
- Legacy 8051 Micro-Controllers using Assembly & C
Internet of Things (IOT)
- General RF Design of:
- RF Matching Networks for 50/75 Ohms & High-Speed & Frequency
- PCB Mounted Antennas for 2.4 GHz, 5 GHz & Chip Antennas
- WiFi (implementing Client & Host for versatile applications)
- Integration w/Web & HTTPS/SSL Security Certificates
- Integration w/AWS IoT Core & FreeRTOS
- Bluetooh 5.0 (low-power designs using Nordic, TI, Cypress PSoC and others)
- Mesh (low-power and/or long-range) using:
- Xbee (Digi), SmartMesh IP (Dust Networks) and others
- LoRa & Mesh Networks & LoRa Gateways using:
- Semtech IC’s & Laird Modules
- Gateways from RAK & Multitech
Harsh Environment & Extreme Miniaturization
- Conversion of circuits to Ceramic Substrates & Exotic Stack-Ups:
- To match CTE of Silicon or other critical material(s)
- Die-Attach & Wire-Bonding with/without Dam & Fill
- Hermetically Sealed Enclosures & Pass-Through Connections
- Enclosures using Kovar, Al, Cu, MoCu, or CuW in “Bathtub” config
- High Temperature DFM Assembly & BGA Under-Fill
- Targeting:
- High Reliability Assemblies
- Extreme Temperature, Vibration & Shock Assemblies
- Extreme Miniaturization of electronic assemblies
- Electro-Mechanical moving or spinning assemblies targeting:
- LiDAR and ultra-light weight for miniature drones
- Downhole Tool, Implantable Medical Devices, Space Applications
Digital Interface Electronic Design
- CAN-Bus (with isolation and lighting protection)
- RS-232 / RS-485 / RS-422 (with isolation and RTCA/DO-160G )
- Ethernet, TCP/IP, UDP/IP, etc…
- PWM (Pulse-Width Modulated) for motor control, cycle-by-cycle current limiting
- SPI, I2C, SDIO, QuadSPI and parallel digital interfaces (Intel and Motorola Standards, etc.)
Analog Interface Electronic Design
- Standard Industrial Interfaces
- 0 ~ 10 Volt Inputs (isolated and non-isolated)
- -10 ~ +10 Volt Outputs
- 4 ~ 20 mA, and other non-standard analog current loops
- Ultra-Low-Noise Power & uV or pA Analog Signal Detection
- HART communication protocol, PROFIBUS-DP, Modbus
- EtherCAT and other industry standard protocols
- Analog Signal Conditioning, (Low-Pass, High-Pass Filters, etc.)
- Ultra-Low-Noise Analog Front End including Trans-impedance Amplifier TIA
- High-Speed/High-Resolution Bi-Polar, Differential ADC w/FPGA Integration
- Closed-Loop control, PID, etc…
PCB Layout
- Mixed Signal Analog/Digital/RF
- RS-232 / RS-485 / RS-422 (w/isolation and RTCA/DO-160G )
- UL & TUV Certification
- IPC Standards including IPC-2221
- High Voltage (multiple kV) & High Current (hundreds of Amps)